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12 Layer ENIG FR4+Rogers Mixed Lamination High Frequency PCB
Layers: 12
Surface finish: ENIG
Base material: Rogers4350B+FR4 TG170
Thickness: 1.65mm
Min. hole diameter: 0.25mm
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Special process:impedance control -
16 Layer ENIG Press Fit Hole PCB
Layers: 16
Surface finish: ENIG
Base material: FR4
Thickness: 3.0mm
Min. hole diameter:0.35mm
Size：420×560mm
Outer Layer W/S: 4/3mil
Inner layer W/S: 5/4mil
Aspect Ratio: 9:1
Special process: via-in-pad, impedance control, press fit hole
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6 Layer ENIG FR4 Via-In-Pad PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3.5mil
Inner layer W/S: 4/3.5mil
Thickness: 2.0mm
Min. hole diameter:0.25mm
Special process: via-in-pad, impedance control
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6 Layer FR4 ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 1.2mm
Min. hole diameter:0.2mm
Special process: Impedance Control
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6 Layer FR4 ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.0mm
Min. hole diameter:0.2mm
Special process: Impedance Control
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4 Layer FR4 OSP Impedance Control PCB
Layers: 4
Surface finish: OSP
Base material: FR4
Outer Layer W/S: 6/4mil
Inner layer W/S: 4/4mil
Thickness: 1.6mm
Min. hole diameter:0.25mm
Special process: Impedance Control
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6 Layer FR4 ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 7/4mil
Inner layer W/S: 7/4mil
Thickness: 2.0mm
Min. hole diameter:0.25mm
Special process: Impedance Control
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4 Layer FR4 ENIG Impedance Control PCB
Layers: 4
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/4mil
Thickness: 1.6mm
Min. hole diameter:0.2mm
Special process: Impedance Control
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4 Layer FR4 Tg150 ENIG PCB
Layers: 4
Surface finish: ENIG
Base material: FR4 Tg150
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 1.0mm
Min. hole diameter: 0.25mm -
2 Layer FR4 Tg170 ENIG PCB
Layers: 2
Surface finish: ENIG
Base material: FR4 Tg170
Outer Layer W/S: 7/4mil
Thickness: 0.8mm
Min. hole diameter: 0.3mm -
10 Layer ENIG FR4 Tg150 PCB
Layers: 10
Surface finish: ENIG
Base material: Medium TG FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 4/4mil
Thickness: 1.6mm
Min. hole diameter: 0.2mm
Special process:gold finger -
16 Layer FR4 ENIG Tg170 PCB
Layers: 16
Surface finish: ENIG
Base material: High TG FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 3.5/3.5mil
Thickness: 2.43mm
Min. hole diameter: 0.75mm
