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6 Layer ENIG Via-In-Pad PCB
Product name: 6 Layer ENIG Via-In-Pad PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
W/S: 5/4mil
Thickness: 1.0mm
Min. hole diameter:0.2mm
Special process: via-in-pad -
8 Layer ENIG Via-In-Pad PCB
Product name: 8 Layer ENIG Via-In-Pad PCB
Layers: 8
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4.5/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.2mm
Min. hole diameter:0.15mm
Special process: via-in-pad -
6 Layer ENIG Via-In-Pad PCB
Product name: 6 Layer ENIG Via-In-Pad PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 7/3.5mil
Inner layer W/S: 7/4mil
Thickness: 0.8mm
Min. hole diameter:0.2mm
Special process: via-in-pad -
6 Layer ENIG Via-In-Pad PCB
Product name: 6 Layer ENIG Via-In-Pad PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3.5mil
Inner layer W/S: 4/3.5mil
Thickness: 2.0mm
Min. hole diameter:0.25mm
Special process: via-in-pad Impedance Control -
10 Layer Impedance Control Resin Plugging PCB
Product name: 10 Layer Impedance Control Resin Plugging PCB
Layers: 10
Surface finish: ENIG
Aspect Ratio: 8:1
Base material: FR4
Outer Layer W/S: 4/4mil
Inner layer W/S: 5/3.5mil
Thickness: 2.0mm
Min. hole diameter:0.25mm
Special process: Impedance Control, Resin Plugging, Different Copper Thickness -
8 Layer ENIG Via-In-Pad PCB
Product name: 8 Layer ENIG Via-In-Pad PCB
Layers: 8
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3.5mil
Inner layer W/S: 4/3.5mil
Thickness: 1.0mm
Min. hole diameter:0.2mm
Special process: via-in-pad, impedance control -
6 Layer ENIG Impedance Control PCB
Product name: 6 Layer ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3.5mil
Inner layer W/S: 4.5/3.5mil
Thickness: 1.0mm
Min. hole diameter:0.2mm
Special process: Impedance Control -
16 Layer ENIG Press Fit Hole PCB
Product name: 16 Layer ENIG Press Fit Hole PCB
Layers: 16
Surface finish: ENIG
Base material: FR4
Thickness: 3.0mm
Min. hole diameter:0.35mm
size：420×560mm
Outer Layer W/S: 4/3mil
Inner layer W/S: 5/4mil
Aspect Ratio: 9:1
Special process: via-in-pad Impedance Control Press Fit Hole -
8 Layer FPC+FR4 Rigid-Flex PCB
Product name: 8 Layer FPC+FR4 Rigid-Flex PCB
Layer: 8
Application Industry: Industrial Control
W/S: 5/5mil
Board Thickness: 1.6mm
MIn. Hole Diameter: 0.2mm
Surface Finish: ENIG
Material: FR4 + FPC
laminate：2R+2F+2F+2R -
8 Layer FPC+FR4 Rigid Flex PCB
Product name: 8 Layer FPC+FR4 Rigid Flex PCB
Number of layers: 8
Application Industry: Industrial Control
Surface finish: ENIG
Base material: FR4 + FPC
W/S: 5/5mil
Thickness: 1.6mm
Min. hole diameter:0.2mm
laminate：2R+2F+2F+2R -
6 Layer FPC+FR4 Rigid-Flex PCB
Product name: 6 Layer FPC+FR4 Rigid-Flex PCB
Layer: 6
Application Industry: Medical ventilator
W/S: 4/4mil
Board Thickness: 0.8mm
MIn. Hole Diameter: 0.15mm
Surface Finish: ENIG
Material: FR4 + FPC -
6 Layer ENIG Impedance Control PCB
Product name: 6 Layer ENIG Impedance Control PCB
Layers: 6
Surface finish: ENIG
Base material: FR4
Outer Layer W/S: 4/3mil
Inner layer W/S: 5/4mil
Thickness: 0.8mm
Min. hole diameter: 0.2mm
Special process: impedance control
